Senior Engineer – Power Magnetics & Module Design

**Huawei's Boltzmann Research Center (Vienna)** is responsible for advanced magnetic technology research, material and process development, design and strategic engineering of our magnetic component.

We focus on the development of soft magnetic materials, permanent magnetic materials, and components which applied in Huawei's ICT products including power supply, wireless communication, etc. Through insight into global magnetic technologies and independent research, we aspire to explore and make breakthroughs in fundamental theories and technologies e.g., computation and simulation, formula design, molding process, etc.

Join us as a

**Senior Engineer – Power Magnetics & Module Design (m/f/d)**

**Your mission**

As a Senior Power Magnetics & Module Design Engineer, you will be responsible for the end-to-end design of high-density, board-mounted power supplies. You will push the limits of W/in³ through advanced integration and high-frequency switching (MHz to tens of MHz), developing **VRMs/IVR** and **isolated/non-isolated DC-DC modules** that power the next generation of processors.

**Design & Optimization

** Propose new concepts, design and optimize magnetic components such as inductors, planar transformers to ensure performance (efficiency, transient response, etc.). Conduct PDN extraction and analysis for power modules to assess power path losses and switch-node ringing.

**Advanced Packaging & Integration

** · Collaborate with package/process engineers to develop advanced packaging solutions (such as 3D stacking, embedded magnetics) that integrate ICs, inductors, and capacitors into a high-density module.

**Multi-Physics Verification

** · Develop and validate finite element analysis (FEA) models to simulate electromagnetic, thermal and mechanical behavior.

**Prototyping & Fabrication

** · Collaborate with prototype teams, suppliers on fabrication to bring concept designs into real products, and validating designs via physical testing.

**Your areas of expertise**

**Educational Background

** Master's or PhD degree in Electrical Engineering, Microelectronics, or a related field.

**Experience

** good **industry experience** in power solutions, specifically in power magnetics and modules design for data centers, telecommunications, or high-performance computing.

**Technical Expertise

**

• Proven expertise in high-current, high-frequency Package-level (IVR) or Board level (VRMs, TLVR, isolated/non-isolated DC-DC) power modules
• Proficiency in the design of high-density inductors/planar transformers (LLC, HSC, etc.), with the ability to judge manufacturing and process feasibility
• Experience with Multi-physics modeling and simulations (COMSOL)
• Deep knowledge of topologies like buck, LLC
• Hands-on experience in PCB layout for high-current-density and high-frequency applications

**Experience with any of below areas is highly preferred:**

• Experience in AI/HPC Power architecture design, board/package/on-chip power delivery, power integrity analysis
• Knowledge or Experience with power module packaging/integration, manufacturing/
• In depth understanding of high-frequency magnetic material behavior, loss modeling, and reliability testing
• Experience with wide-bandgap semiconductors (LV GaN), electromigration simulation of solder joints
• Agile thinking, with the ability to think outside the box and propose flexible, diversified solutions
• Self-motivated to drive projects with excellent execution capabilities
• Fluency in written and spoken English

By applying to this position, you agree with our Recruitment Privacy Statement. You can read in full our privacy policy [here](http://career.huawei.com/reccampportal/portal/hrd/weu_rec_all.html).

**Your rewards of working here**

• Our culture is characterized by innovative power and team spirit as well as the intensive exchange of knowledge and experience within our global network.
• To keep your development ongoing, you will find a broad range of training opportunities. Many online and face-to-face training programs incl. language courses in German and Mandarin.
• Our diverse and welcoming environment is shaped by different backgrounds and around 40 individual nationalities.
• Self-responsible work in a competent, motivated and constantly growing team.

If you are enthusiastic in shaping Huawei’s Boltzmann Research Center (Vienna) together with a multicultural team of highly skilled Engineers and Researchers, feel free to contact us. Driving future technologies focused on the customer experience is our main mission. **Apply now!**

_Please send your application and CV (incl. cover letter and reference letters) in English._

**Huawei** is a leading global information and communications technology (ICT) solutions provider. Our ICT solutions, products and services are used in more than 170 countries and regions, serving over one-third of the world's population. With 208,000 employees, Huawei is committed to develop the future information society and build a Better Connected World.